PIC Packaging Services

In 2006, PhotonFirst pioneered the development of the world's first Photonic Chip-based Sensing solution. Since then, we have been continuously developing and enhancing our Photonic Integrated Circuit (PIC) packaging capabilities as part of our product production process. As this process matured, PhotonFirst began offering this capability as an external service 10 years ago, assisting customers in developing their PIC-based solutions.

Integrated circuits allow for smaller, faster and affordable solutions

PIXapp Package

Key benefits of selecting PhotonFirst as your Packaging Partner

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Fiber to Chip Coupling

Our advanced techniques ensure efficient and reliable connections, with low loss coupling.

Custom Package Designs

Custom Package Designs

We create custom package designs tailored to specific environmental or dimensional needs.

Rapid Prototyping

Rapid Prototyping

We understand the value of quick iterations to rapidly learn and improve designs.

Tools to get you started

Standard Package Solutions Overview

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PIC Design Guidelines & Rules

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Our Customers

Packaging

Examples

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3-Jul-11-2024-08-39-34-7706-AM
2-Jul-11-2024-08-39-27-2572-AM
1-Jul-11-2024-08-39-15-7550-AM

Innovation Partnership Programs

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Want more info? 

Let PhotonFirst be your PIC packaging partner