PIC Packaging Services
In 2006, PhotonFirst pioneered the development of the world's first Photonic Chip-based Sensing solution. Since then, we have been continuously developing and enhancing our Photonic Integrated Circuit (PIC) packaging capabilities as part of our product production process. As this process matured, PhotonFirst began offering this capability as an external service 10 years ago, assisting customers in developing their PIC-based solutions.
Integrated circuits allow for smaller, faster and affordable solutions
![PIXapp Package PIXapp Package](https://www.photonfirst.com/hs-fs/hubfs/PIXapp%20Package.png?width=370&height=409&name=PIXapp%20Package.png)
Key benefits of selecting PhotonFirst as your Packaging Partner
![Website 2024 800 x 533 imagery-2 Website 2024 800 x 533 imagery-2](https://www.photonfirst.com/hubfs/Website%202024%20800%20x%20533%20imagery-2.png)
Fiber to Chip Coupling
Our advanced techniques ensure efficient and reliable connections, with low loss coupling.
![Custom Package Designs Custom Package Designs](https://www.photonfirst.com/hubfs/30.png)
Custom Package Designs
We create custom package designs tailored to specific environmental or dimensional needs.
![Rapid Prototyping Rapid Prototyping](https://www.photonfirst.com/hubfs/31.png)
Rapid Prototyping
We understand the value of quick iterations to rapidly learn and improve designs.
Tools to get you started
Our Customers
![LUXQUANTA](https://www.photonfirst.com/hs-fs/hubfs/21-3.png?width=800&height=533&name=21-3.png)
![Ligentec](https://www.photonfirst.com/hs-fs/hubfs/6-Jul-11-2024-08-51-02-8837-AM.png?width=800&height=533&name=6-Jul-11-2024-08-51-02-8837-AM.png)
![CMC Microsystems](https://www.photonfirst.com/hs-fs/hubfs/7-Jul-11-2024-08-51-11-6731-AM.png?width=800&height=533&name=7-Jul-11-2024-08-51-11-6731-AM.png)
![IHP](https://www.photonfirst.com/hs-fs/hubfs/8-Jul-11-2024-08-51-24-7526-AM.png?width=800&height=533&name=8-Jul-11-2024-08-51-24-7526-AM.png)
![Pilot Photonics](https://www.photonfirst.com/hs-fs/hubfs/9-4.png?width=800&height=533&name=9-4.png)
![VLC](https://www.photonfirst.com/hs-fs/hubfs/10-4.png?width=800&height=533&name=10-4.png)
![Superlight Photonics](https://www.photonfirst.com/hs-fs/hubfs/22-2.png?width=800&height=533&name=22-2.png)
![Tyndall](https://www.photonfirst.com/hs-fs/hubfs/12-3.png?width=800&height=533&name=12-3.png)
![Astron](https://www.photonfirst.com/hs-fs/hubfs/15-2.png?width=800&height=533&name=15-2.png)
![FAU](https://www.photonfirst.com/hs-fs/hubfs/23-2.png?width=800&height=533&name=23-2.png)
![ETH Zurich](https://www.photonfirst.com/hs-fs/hubfs/19-Jul-11-2024-08-52-07-9531-AM.png?width=800&height=533&name=19-Jul-11-2024-08-52-07-9531-AM.png)
![Technische Universiteit Dresden](https://www.photonfirst.com/hs-fs/hubfs/16-4.png?width=800&height=533&name=16-4.png)
![Scantinel](https://www.photonfirst.com/hs-fs/hubfs/18-3.png?width=800&height=533&name=18-3.png)
![Lens R&D](https://www.photonfirst.com/hs-fs/hubfs/14-3.png?width=800&height=533&name=14-3.png)
![TU/e](https://www.photonfirst.com/hs-fs/hubfs/20-4.png?width=800&height=533&name=20-4.png)
![Want](https://www.photonfirst.com/hs-fs/hubfs/13-4.png?width=800&height=533&name=13-4.png)
Packaging
Examples
Innovation Partnership Programs
![PhotonicsFAB](https://www.photonfirst.com/hs-fs/hubfs/22-1.png?width=800&height=533&name=22-1.png)
![PIXapp](https://www.photonfirst.com/hs-fs/hubfs/21-2.png?width=800&height=533&name=21-2.png)
![ISROS](https://www.photonfirst.com/hs-fs/hubfs/23-1.png?width=800&height=533&name=23-1.png)
![PhotonFirst 2022-109-1 PhotonFirst 2022-109-1](https://www.photonfirst.com/hubfs/PhotonFirst%202022-109-1.jpeg)