
PIC Packaging Insights from an Industry Expert
Photonics Integrated Circuits (PICs) are at the forefront of advanced technology, driving innovation in diverse fields such as telecommunications, data communication, aerospace, and quantum computing. However, the successful integration and deployment of PICs heavily relies on robust packaging solutions that ensure their protection, performance, and reliability. In this blog based on an interview with Elvis Wan, an expert from PhotonFirst, we gain insights into the world of PIC packaging and discover how PhotonFirst is setting new standards with our comprehensive approach.