PIC Packaging for Mission-Critical Systems
Qualified. Deployed. Proven.

From prototype to deployment in aerospace, infrastructure, offshore and quantum systems - We package PICs for the world's most demanding environments and develop the systems required to operate them.
Aerogator NG4
Photonfirst GB01 - Vrijstraand - 300x200-1

Why PIC packaging matters for your application

Photonic integrated circuits (PICs) enable smaller, faster and more efficient systems across many industries, but only if it is packaged the right way. We design and manufacture packages that keep working under vibration, temperature swings and other harsh conditions found in aerospace, rail, maritime and energy applications.

From the first prototype and proof-of-concept to a ruggedized module that flies on aircrafts, operate within the narrow window of tolerance at data centres and function in industrial harsh environments, we engineer packages that are built for deployment, not just for the lab. Qualified. Deployed. Proven.

What you get with PhotonFirst

  • High reliability - Cleanroom manufacturing (ISO 14644-1 Class 8 environment with strict ESD controls) and proven performance in mission‑critical applications

  • Scalability - A single packaging roadmap from first prototypes to mid‑volume modules, avoiding costly redesigns

  • Harsh‑environment expertise - Packages engineered for shock, vibration and thermal extremes in aerospace, railway, maritime and energy systems compliant to DO and MIL standards 

  • System integration & qualification - Support from packaged PIC to fully integrated system, including environmental testing, qualification of the system and preparation for aerospace and industrial standards

  • Proven track record - Numerous unique packaging designs deployed in real‑world infrastructure and industrial projects, including our own aerospace interrogators

Harsh environments need photonics

Harsh environments do not just need photonics; they need harsh‑environment‑grade PIC packaging. Packages must keep fiber‑to‑chip alignment stable under shock and vibration, maintain optical performance across wide temperature ranges, manage heat inside dense PICs, and protect the system against radiation and moisture satisfying standards like DO‑160G, MIL‑STD‑810, MIL-STD-883-F and MIL‑STD‑461.​

This is the space PhotonFirst owns: PIC packaging that is designed so photonic systems do not just function in harsh environments – they thrive there, proven by our proprietary PIC-based interrogators already deployed in aerospace, defence platforms, offshore energy, nuclear plants, quantum computing, data centres and critical infrastructure.​

Where our PIC packages are used

Photonic Integrated Circuits allow for smaller, faster and affordable solutions in harsh environments

Recent applications in harsh environments

Solinide 2-1

Quantum - Solinide

Solinide needed a partner with the experience and infrastructure to handle precision photonic packaging: fiber coupling, laser alignment, and thermal management. All at micron-level accuracy.

Getting_ready_to_hoist_Themis_T1H_on_the_launch_pad

Aerospace - ArianeGroup

Our integrated photonics-based fiber optic sensing systems are now being deployed by ArianeGroup on Themis, the reusable first-stage demonstrator for Europe’s next-generation launcher.

AGTR-NG4-1

Aerospace interrogators

Our AGTR-NG4 and AGTR-NEO interrogators represent the forefront of Fiber Bragg Grating (FBG) technology, engineered to deliver unparalleled performance in the most challenging aerospace and defense environments. 

Our PIC Packaging Portfolio
Today’s prototype can evolve into tomorrow’s industrial module

We do not only package PICs; we are able to design complete packaging journeys that already comply with aerospace and defense‑grade requirements, using the same principles that power our own DO‑160G and MIL‑STD‑compliant interrogators, the NEO and NG4. We use DFM methodologies to always design with an eye on seamlessly scaling from prototypes to < €1k industrial units without “starting over” at each phase.​​

Photonfirst GP010203

GP01/02/03

  • Designed for flexibility
  • Fast & affordable prototyping
  • 40GHz maximum frequency
Photonfirst GB01

GB01

  • High speed (4x RF)
  • Fast & affordable prototyping
  • 50GHz maximum frequency
Photonfirst SIP01

SIP01

  • Opto-electric, multi-chip integration
  • Miniaturizing functional complexity
Photonfirst BP01

BP01

  • Standard form factor
  • High volume, single function
  • 10 MHz maximum frequency

XE01

  • Extreme harsh environment
  • Complete system OEM integration
  • 100kHz maximum frequency
2024_Phononfirst_004-2

CU01 ..x

  • High volume, fit for application
  • Multi-purpose OEM integration
  • Customizable maximum frequency

PhotonFirst: A mission-critical systems partner

Our PIC packaging services
From first PIC prototype to integration into mission-critical systems

Many providers focus either on prototyping or on volume manufacturing. At PhotonFirst, we deliberately do both. We know that most projects start small – a handful of packaged samples for R&D – but need to grow into scalable industrial solutions. That is why our services are designed so you never have to start over when scaling up.

Development & prototyping

Fiber(array)-coupled, compact solutions capable of up to 10 GHz modulation for laboratory testing and rapid protoyping. Get your PIC out of the lab fast – with package designs that are ready for scaling.

Typical packages: GP01/02/03, GB01

Ruggedized harsh‑ environment modules

Packages built to survive shock, vibration, EMI and temperature extremes – using the same design principles as our aerospace‑qualified interrogators.


Typical packages: XE01

Miniaturized & integrated modules

PIC, Fibers, Fiber Arrays and PCBAs combined into ultra-compact, rugged, lightweight modules that actually fit inside nacelles, drones, pods, housings and tight system envelopes.


Typical packages: SIP01, BP01

Custom PIC Package

When your application doesn’t fit the catalogue: co‑developed packages and modules, tailored to your (harsh) application environment. Specially tuned to meet your unique optical, thermal, or mechanical requirements.

Typical packages: CU01..x

From PIC to system

PhotonFirst has track record in deploying PICs in humble to challenging environments. We can help you shape your journey from a bare PIC die all the way to tested and deployed system in the field.

Typical systems: AGTR-NEO, AGTR-NG4

Our PIC packaging capabilities

End-to-end service – From design and (rapid) prototyping to small-series production and system integration 

PIC Package Design

Design

Our expert team can assist you in the design of your PIC package and even in the floorplan of your PIC Input/Output. We consider mechanical, thermal and reliability aspects of your end application during the design of your PIC package, together with your team.

PIC Testing

PIC Testing
We offer die-level optical and electrical testing of your PIC before assembly. This allows us to identify known good dies to package and therefore significantly increase the chance of a successfully packaged PIC.

Die-bonding

Die-Bonding
Our die bonding capabilities can be tuned to your needs ranging from ± 20 µm all the way down to ± 5 µm accuracy. We use automatic die bonders and can glue or solder the dies to the submount or TEC of your choice, followed by detailed inspection.

Wire-bonding

Wire-bonding
Our cleanroom is equipped with both manual and automated wire bonders. This allows us to cater to both small and large volumes and can wire bond complicated pad layouts and PCB traces. We offer Gold ball and wedge bonding and also Aluminium wedge bonding. This allows us to cover DC up to 10 GHz modulation range in our standard offering, but we can also offer higher frequency bonds if required for a specific application.

Fiber Alignment

Fiber Alignment
We offer several options for single fibre alignment using both active alignment assembly based on monitoring a signal through the fibre during alignment or a computer vision based placement and gluing of fibre in v-grooves on your die. 

Fiber welding

Fiber welding

This is a unique capability, where we offer a laser based technique for welding the fibre to the submount. This is highly suitable for rugged and harsh environments and is – in fact – the technique we use for our own PIC in our interrogator families.

Fiber array alignment

Fiber array alignment

We are experts in low-loss fibre array assembly ranging from 6 channels all the way up to 128 channels. We rely on active alignment for this and use loopbacks on the PIC to achieve very low insertion penalty from the packaging. We can handle interposers, Edge or vertical coupling and offer a wide range of fibres, suitable for your application wavelength. This allows us to match the MFD of your PIC to the fibre of your choice.

System Integration

System Integration
Your journey with PhotonFirst does not stop at the PIC package. As one of the few companies in the world with PIC based system in the field in real world (harsh environment) applications, we offer our expertise to help you on your journey towards your application. This included system design, electronics design and manufacturing, software development and system testing and validation. 

What sets PhotonFirst apart
More than a packaging line – a mission‑critical systems partner 

Proven track record in harsh environments, not just the lab

We don’t stop at “optically aligned and sealed”. Numerous unique PIC packages were designed for aerospace, rail, offshore and wind – with harsh environmental requirements (shock, vibration, EMI, temperature, humidity) built in from day one. 


Aerogator NG4

Interrogators as proof of system integration capabilities

Most packagers show fixtures; we show flight‑ready interrogators. The same team that packages your PIC also designs and qualifies our own PIC‑based interrogators for aerospace and defense, proving we understand the full system – optics, mechanics, electronics and software.


From prototypes to modules ready for <€1k/unit volumes

We use Design For Manufacturing (DFM) methodologies with a continuous focus towards scaling of your product volumes. The path from your first proof of concept package and low volume production to high volume OEM integration uses the same design principles, process controls and cleanroom line – with no need for new suppliers or redesign.


Co‑development instead of black‑box manufacturing

We don’t just “take a drawing and build a box”, we take care of a complete (custom) package development. We work with your engineers on PIC design rules, thermal and mechanical constraints, and qualification plans – translating your system requirements into PIC, package and test specifications:

  • Option A: Your package is developed to your spec with our industrialization know-how, ensuring it fits the exact application
  • Option B: Choose from a wide range of standard packages for a quick start

Technical resources to get you started

Overview of PhotonFirst PIC packages

Standard Packages

25-2-1-1

PIC Design
Rules

chip funding

Your own PIC Package

Customers that partner with us

Innovation Partnership Programs

PhotonFirst 2022-109-1

WOULD YOU lIKE more information? 

Let PhotonFirst be your PIC packaging partner