PhotonFirst Blog

PhotonFirst and Curtiss‑Wright are joining forces to bring integrated fiber optic sensing (FOS) into mainstream Flight Test Instrumentation (FTI), combining PhotonFirst’s Fiber Bragg Grating (FBG) and photonic expertise with Curtiss‑Wright’s leading FTI platforms and global aerospace reach.

Lens R&D and PhotonFirst join forces to bring space grade photonic innovation from concept to scalable production, starting with the MAUS CubeSat sun sensor and its custom PIC package. This partnership combines Lens R&D’s heritage in high reliability sun sensors with PhotonFirst’s PIC packaging capabilities for harsh environments.

Amsterdam’s historic canals and bridges were never built for today’s 30‑ton trucks, yet they carry them every day. To keep quay walls and bridges safe without shutting the city down, Amsterdam needs reliable data on what really drives over its infrastructure – not just assumptions.

For years, optical frequency combs have been one of those photonics technologies that promised a lot, but rarely made it out of the lab. The concept is powerful: A single light source that delivers dozens of perfectly spaced laser lines. But in practice, most combs were big, power-hungry, and far too inefficient for industrial use.

A satellite orbiting Earth, while collecting key data on temperature, pressure, and radiation, is becoming a reality thanks to the efforts of a dedicated student team and PhotonFirst

It was recently announced that the Netherlands will benefit from a substantial investment in the photonics industry by the EU. Out of a total investment of 380 million Euros across the European Union, the Netherlands will receive a share of 133 million Euros for the development of a pilot photonic chip factory. 

Join us at PhotonFirst as we take Fiber Optic Sensing (FOS) from the research lab to real-world applications. Discover how our innovative, chip-based FOS technology is transforming industries by providing precise, reliable, and scalable measurement solutions.

At PhotonFirst, we are excited to share our experiences and successes from the recent PIC Summit Europe held in Eindhoven. The event, organized by PhotonDelta, was a significant gathering in the photonic integrated circuits (PIC) industry, and it provided us with an great platform to present our ambition, "Packaging the Future of PIC."

Photonics Integrated Circuits (PICs) are at the forefront of advanced technology, driving innovation in diverse fields such as telecommunications, data communication, aerospace, and quantum computing. However, the successful integration and deployment of PICs heavily relies on robust packaging solutions that ensure their protection, performance, and reliability. In this blog based on an interview with Elvis Wan, an expert from PhotonFirst, we gain insights into the world of PIC packaging and discover how PhotonFirst is setting new standards with our comprehensive approach.

As electronic systems become more and more sensitive to outside influences, it's increasingly important for the facilities that handle them to maintain strict quality control standards. That's why PhotonFirst has introduced a quality framework designed to protect the quality of our products during production and factory acceptance testing. In this blog post, we'll take a closer look at what this new quality framework entails and how it benefits our customers.